Placement Module Course description（英文版）(ppt 83頁)

Placement Module Course description（英文版）內容提要：
Ch-0: Course Description [5 min]
Ch 1: Placement Module Overview [30 min]
Describe placement module functionality and features
Define different types of placement equipments available
Describe the placement main systems
Understand the placement module future key challenges
Ch 2: SPEC OVERVIEW[15 min]
Find the appropriate spec for the placement module.
Navigate through the spec and use it as a reference document.
Educate how to understand Intel process and applied the knowledge when dealing with customers.
Ch-3: Process Control System[20 min]
Understand what is Process Control System
Identify process control system used by placement module owner
Ch 4: Critical to Function Parameter (CTFP) [20 min]
Identify major parameter used for the placement module
Define the impact of the major parameter
Ch 5: Response Flow Check list (RFC) & Common Failure modes [15 min]
Identify common failure modes for placement module
Describe how to solve placement issues
Ch 6 : CASE STUDY ON SJR [15 min]
To have basic understanding on BGA SJR in terms of failure modes and potential root causes.
To develop CQE competency in providing some solutions or prelim data collection on BGA SJR related issues.
Glossary

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