BGA和CSP檢查英文(ppt 16頁)

BGAandCSPInspection
IntroducingSolvision’s
OurMission:
ProvideInnovativeSolutionsinVision-basedtechnologytoHelpourClientsStrengthentheirCompetitiveEdge.
NeedsforBGAProductionLine
Quality
Cost
Yield
LeadTime
3stepssolutioninVisionInspection:BGAFalconPro
1-FMITechnology
2-AutomaticHandling
3-In-ProcessInspectionCapability
FMITechnology
UniquePatentPendingTechnology
Real3-DmappingoftheentireFOV
HighLevelDeepdataaccuracy
AdaptabletonewProcessenvironment
BGA,CGA,CSP,Waferbumps:Extendabletosub-micron
FMITechnologyforMoreBenefits
Real3-Dmappingandcombined2DmeasurementsoftheentireFieldofView
-Substratewarpage,peeloff,
-True3-DBallshapeforBGAandCSPpackage
-Grid-to-fiducial,chipout,
oxidizations…
AutomaticHandling
Multi-Function(VisionandHandlingTransferTool)
SingleHandlingStation
Noneedformanualhandling
NoneedtoSeparateHandlingandStand-AloneVision
In-ProcessinspectionCapability
100%QualityControl
RealTimeInspectionforProcessControl
AllowimmediateactiontoProcessDrift
ReduceWaste&Reworks
YieldImprovement
ReduceLeadTime

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