BGA封裝工藝簡介(PPT 55頁)

BGA Package Structure
Typical Assembly Process Flow
FOL– Front of Line前段工藝
FOL– Front of Line Wafer
FOL– Back Grinding背麵減薄
FOL– Wafer Saw晶圓切割
FOL– Optical Inspection
FOL– Die Attach 芯片粘接
FOL– Epoxy Cure 銀漿固化，檢驗
FOL– Wire Bonding 引線焊接
FOL–Optical Inspection 檢查
正常品
Material Problem
1st Bond Fail ( I )
1st Bond Fail (II)
1st Bond Fail ( III )
1st Bond Fail (IV)
1st Bond Fail (V)
Bonding Weld Inspection
2nd Bond Fail ( II )
Looping Fail(Wire Short I)
Looping Fail(Wire Short II)
Looping Fail(Wire Short III)
EOL– End of Line後段工藝
EOL– Molding（注塑）
EOL– Molding（注塑）
EOL– Post Mold Cure（模後固化）
EOL– Laser Mark（激光打字）
EOL– Ball Attach 植球
Ball REFLOW 參數
EOL– Singulation
EOL– Singulation
EOL– Test 測試
EOL– Final Visual Inspection（終檢）
EOL– Packing 包裝
..............................