華碩電腦SMT外觀允收要求(ppt 55頁)

華碩電腦SMT外觀允收要求目錄：
PCBA 半成品握持方法--------------------------------------------------------1-3
PCBA WIP Handing
SMT零件組裝工藝標準--芯片狀(Chip)零件之對準度 (組件X方向)------------------1-4
SMD Assembly workmanship criteria--Chip component alignment( X Axis)
SMT零件組裝工藝標準--芯片狀(Chip)零件之對準度 (組件Y方向)------------------1-5
SMD Assembly workmanship criteria--Chip component alignment( Y Axis)
SMT零件組裝工藝標準--圓筒形（Cylinder）零件之對準度------------------------1-6
SMD Assembly workmanship criteria--Cylinder component alignment
SMT零件組裝工藝標準--鷗翼(Gull-Wing)零件腳麵之對準度-----------------------1-7
SMD Assembly workmanship criteria--Gull-Wing footprint alignment
SMT零件組裝工藝標準--鷗翼(Gull-Wing)零件腳趾之對準度-----------------------1-8
SMD Assembly workmanship criteria--Gull-Wing toe alingnment
SMT零件組裝工藝標準--鷗翼(Gull-Wing)零件腳跟之對準度-----------------------1-9
SMD Assembly workmanship criteria--Gull-Wing heel alingnment
SMT零件組裝工藝標準--零件腳麵(Latch of CN2302) 之對準度 -------------------1-10
SMD Assembly workmanship criteria-Component footprint (Latch of CN2302) alignment
SMT零件組裝工藝標準--J型腳零件對準度---------------------------------------1-11
SMD Assembly workmanship criteria--J type lead alignment
SMT焊點性工藝標準--鷗翼(Gull-Wing)腳麵焊點最小量---------------------------1-12
SMD solder joint workmanship criteria--Minimum solder of Gull Wing footprint
SMT焊點性工藝標準--鷗翼(Gull-Wing)腳麵焊點最大量---------------------------1-13
SMD solder joint workmanship criteria--Maximum solder of Gull Wing footprint
SMT焊點性工藝標準--鷗翼(Gull-Wing)腳跟焊點最大量---------------------------1-14
SMD solder joint workmanship criteria--Minimum solder of Gull Wing Heel
SMT焊點性工藝標準--J型接腳零件之焊點最小量---------------------------------1-15
SMD solder joint workmanship criteria--Minimum solder of J type lead
SMT焊點性工藝標準--J型接腳零件之焊點最大量工藝水平點-----------------------1-16
SMD solder joint workmanship criteria--Maximum solder of J type lead
SMT焊點性工藝標準-芯片狀(Chip)零件之最小焊點(三麵或五麵焊點) --------------1-17
SMD solder joint workmanship criteria--Minimum solder fillet of chip component( 3 or 5 face terminations)
SMT焊點性工藝標準--芯片狀(Chip)零件之最大焊點(三麵或五麵焊點)--------------1-18
SMD solder joint workmanship criteria--Maximum solder fillet of chip component ( 3 or 5 face terminations)
SMT焊錫性工藝標準--焊錫性問題(錫珠、錫渣) ---------------------------------1-19
SMD solder joint workmanship criteria--Other solder issue ( solder ball , solder dross)
DIP零件組裝工藝標準--臥式零件組裝之方向與極性------------------------------1-20
DIP component Assembly workmanship criteria--Direction and polarity of horizontally , mounted
DIP零件組裝工藝標準--立式零件組裝之方向與極性------------------------------1-21
DIP component Assembly workmanship criteria--Direction & polarity of vertically mounted
DIP零件組裝工藝標準--零件腳長度標準----------------------------------------1-22
DIP component Assembly workmanship criteria--Length of component lead
DIP零件組裝工藝標準--臥式電子零組件(R,C,L)浮件與傾斜(1) -------------------1-23
DIP component Assembly workmanship criteria--Tilt & floating of horizontal electronic component ( R , C , L )
DIP零件組裝工藝標準--臥式電子零組件(Wire)浮件與傾斜(2) --------------------1-24
DIP component Assembly workmanship criteria--Tilt & floating of horizontal electronic component ( Wire )
DIP零件組裝工藝標準--立式電子零組件(C,F,L,Buzzer)浮件----------------------1-25
DIP component Assembly workmanship criteria--Floating of vertical electronic component ( C , F , L , Buzzer )
DIP零件組裝工藝標準--立式電子零組件(C,F,L,Buzzer)傾斜----------------------1-26
DIP component Assembly workmanship criteria--Tilt of verticle electronic component ( C , F , L , Buzzer )
DIP零件組裝工藝標準--機構零件(Slot,Socket,DIM,Heat sink)浮件---------------1-27
DIP component Assembly workmanship criteria--Floating of constructive component ( slot , socket , Dim , Heats sink )
DIP零件組裝工藝標準--機構零件(Slot,Socket,DIM,Heat sink)傾斜--------------1-28
DIP component Assembly workmanship criteria--Tilt of constructive component ( slot , socket , Dim , Heat sink )
DIP零件組裝工藝標準--機構零件(Jumper Pins,Box Header)浮件-----------------1-29
DIP component Assembly workmanship criteria--Floating of constructive component ( Jumper Pins , Box header )
DIP零件組裝工藝標準--機構零件(Jumper Pins,Box Header)傾斜-----------------1-30
DIP component Assembly workmanship criteria--Tilt of constructive component ( Jumper Pins , Box header )
DIP零件組裝工藝標準--機構零件(CPU Socket)浮件與傾斜-----------------------1-31
DIP component Assembly workmanship criteria--Tilt and floating of constructive component ( CPU Socket )
DIP零件組裝工藝標準－機構零件(USB,D-SUB,PS/2,K/B & general con. Jack)浮件與傾斜--1-32
DIP component Assembly workmanship criteria--Tilt and floating of constructive component ( USB , D-sub , PS/2 , K/B & general connector Jack )
DIP零件組裝工藝標準--機構零件(Power Connector)浮件與傾斜------------------1-33
DIP component Assembly workmanship criteria--Tilt and floating of constructive component ( Power Connector )
DIP零件組裝工藝標準--機構零件(Jumper Pins,Box Header)組裝外觀(1)----------1-34
DIP component Assembly workmanship criteria--Workmanship (1) of constructive component(Jumper Pin,Box header)
DIP零件組裝工藝標準--機構零件(Jumper Pins,Box Header)組裝外觀(2)----------1-35
DIP component Assembly workmanship criteria--Workmanship(2) of constructive component(Jumper Pins,Box header)
DIP零件組裝工藝標準--機構零件(BIOS & Socket)組裝外觀(3） -----------------1-36
DIP component Assembly workmanship criteria--Workmanship (3) of constructive component ( BIOS & Socket )
DIP零件組裝工藝標準--組裝零件腳折腳、未入孔(1) ---------------------------1-37
DIP component Assembly workmanship criteria--Lead bend and no-inside the hole (1) of assembley
DIP零件組裝工藝標準--零件腳折腳、未入孔、未出孔(2) -----------------------1-38
DIP component Assembly workmanship criteria--Lead bend no-inside no-through (2) of the hole
DIP零件組裝工藝標準--板彎、板翹、板扭(平麵度) ----------------------------1-39
DIP component Assembly workmanship criteria--board wrapage
DIP零件組裝工藝標準--零件腳與線路間距-------------------------------------1-40
DIP component Assembly workmanship criteria--the space between lead to trace
DIP零件組裝工藝標準--零件破損(1) -----------------------------------------1-41
DIP component Assembly workmanship criteria--component broken (1)
DIP零件組裝工藝標準--零件破損(2) -----------------------------------------1-42
DIP component Assembly workmanship criteria--component broken (2)
DIP零件組裝工藝標準--零件破損(3) -----------------------------------------1-43
DIP component Assembly workmanship criteria--component broken (3)
DIP零件組裝工藝標準--機構零件(USB)偏移率----------------------------------1-44
DIP component Assembly workmanship criteria--Shifted rate of constructive component ( USB connector)
DIP零件組裝工藝標準--機構零件(DC Jack)對準度------------------------------1-45
DIP component Assembly workmanship criteria--Shifted rate of constructive component ( DC_In connector)
DIP焊錫性工藝標準--零件麵孔填錫與切麵焊錫性標準(1) -----------------------1-46
DIP soldering workmanship --the solder fillet in the PTH by cross-section (1)
DIP焊錫性工藝標準--零件麵孔填錫與切麵焊錫性標準(2) -----------------------1-47
DIP soldering workmanship --the solder fillet in the PTH by cross-section (2)
DIP焊錫性工藝標準--焊錫麵焊錫性標準(1) -----------------------------------1-48
DIP soldering workmanship --soldering standard on solder side (1)
DIP焊錫性工藝標準--焊錫麵焊錫性標準(2) -----------------------------------1-49
DIP soldering workmanship --soldering standard on solder side (2)
DIP焊錫性工藝標準--焊錫麵焊錫性標準(3) -----------------------------------1-50
DIP soldering workmanship --soldering standard on solder side (3)
DIP焊錫性工藝標準--DIP插件孔焊錫性檢驗圖示--------------------------------1-51
DIP soldering workmanship --Figure of PTH solder fillet evaluation
DIP焊錫性工藝標準--焊錫性問題(錫橋、短路、錫裂) --------------------------1-52
DIP soldering workmanship --soldering issue ( Bridge , short , crack )
DIP焊錫性工藝標準--焊錫性問題(空焊、錫珠、錫渣、錫尖) --------------------1-53
DIP soldering workmanship --soldering issue ( missing solder , solder ball , solder dross , solder peak )
金手指工藝標準--沾錫、沾漆、沾膠、刮傷翹起--------------------------------1-54
Gold finger workmanship

..............................