線路板流程術語中英文對照(doc 52頁)

摘要
A. 開料( Cut Lamination)
a-1 裁板( Sheets Cutting)
a-2 原物料發料(Panel)(Shear material to Size)
B. 鑽孔(Drilling)
b-1 內鑽(Inner Layer Drilling )
b-2 一次孔(Outer Layer Drilling )
b-3 二次孔(2nd Drilling)
b-4 雷射鑽孔(Laser Drilling )(Laser Ablation )
b-5 盲(埋)孔鑽孔(Blind & Buried Hole Drilling)
C. 幹膜製程( Photo Process(D/F))
c-1 前處理(Pretreatment)
c-2 壓膜(Dry Film Lamination)
c-3 曝光(Exposure)
c-4 顯影(Developing)
c-5 蝕銅(Etching)
c-6 去膜(Stripping)
c-7 初檢( Touch-up)
c-8 化學前處理,化學研磨( Chemical Milling )
c-9 選擇性浸金壓膜(Selective Gold Dry Film Lamination)
c-10 顯影(Developing )
c-11 去膜(Stripping )
Developing , Etching & Stripping ( DES )
D. 壓合Lamination
d-1 黑化(Black Oxide Treatment)
d-2 微蝕(Microetching)
d-3 鉚釘組合(eyelet )
d-4 疊板(Lay up)
d-5 壓合(Lamination)
d-6 後處理(Post Treatment)
d-7 黑氧化( Black Oxide Removal )
d-8 銑靶(spot face)
d-9 去溢膠(resin flush removal)
E. 減銅(Copper Reduction)
e-1 薄化銅(Copper Reduction)
F. 電鍍(Horizontal Electrolytic Plating)

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