直流-直流轉換器設計指南(英文)(pdf 23頁)

INTRODUCTION
Manufacturers of electronic systems that require power
conversion are faced with the need for higher-density dc-to-dc
converters that perform more efficiently, within a smaller
footprint, and at lower cost—despite increasing output loads.
To meet these demands, Siliconix has combined advanced
TrenchFETR and PWM-optimized process technologies,
along with innovative new packages, to provide:
D lowest on-resistance for minimum power dissipation
D lowest gate charge for minimum switching losses
D dV/dt shoot-through immunity1
D improved thermal management.
Breakthroughs in thermal management for increasing power
density are being achieved with Vishay Siliconix packaging
technologies such as the PowerPAKt (Si7000 Series), the
thick leadframe D2PAK (SUM Series), and ChipFETt(Si5000
Series).
D The PowerPAK SO-8 offers the steady-state thermal
resistance of a DPAK in an SO-8 footprint.
D The PowerPAK 1212-8 is approximately half the size of a
TSSOP-8 while decreasing the thermal resistance by an
order of magnitude.
D The SUM Series reduces thermal resistance by 33% over
standard D2PAK packaging.
D ChipFET is 40% smaller than a TSOP-6 package while
offering lower on-resistance and lower thermal resistance.
It should be noted that lower thermal resistance results in
higher possible maximum current and power dissipation.
The complete array of Vishay Siliconix MOSFET-packaged
products ranges from the D2PAK (SUM or SUB series), DPAK
(SUD Series), and PowerPAK (Si7000 Series) types of
packages to the LITTLE FOOTR packages. These small
outline devices range from the SO-8 down to the tiniest
MOSFET available - the LITTLE FOOT SC-89.……
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