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世界半導體生產機台安全設計驗收標準英文版(doc 111)

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世界半導體生產機台安全設計驗收標準英文版(doc 111)內容簡介

Section 1.0 MANAGEMENT SUMMARY(管理摘要)
Section 2.0 SCOPE(範圍)
Section 3.0 SYSTEM DESCRIPTION(係統描述)
Section 4.0 ASSESSMENT & TESTING METHODOLOGIES(試驗方法)
Section 5.0 SAFETY ASSESSMENT(安全評估)
5.1 PURPOSE(目的)
5.2 SCOPE(適用範圍)
5.3 SAFETY PHILOSOPHY(安全體係)
5.4 GENERAL GUIDELINES(指導方針)
5.5 SAFETY-RELATED INTERLOCKS(安全互鎖)
5.6 CHEMICALS(化學品)
5.7 IONIZING RADIATION
5.8 NON-IONIZING RADIATION
5.9 NOISE(噪音)
5.10 VENTILATION AND EXHAUST(通風與排鳳)
5.11 ELECTRICAL
5.12 EMERGENCY SHUTDOWN(緊急停機)
5.13 HEATED CHEMICAL BATHS
5.14 HUMAN FACTORS ENGINEERING
5.15 ROBOTIC AUTOMATION
5.16 HAZARD WARNING(危險警告)
5.17 EARTHQUAKE PROTECTION(地震警告)
5.18 DOCUMENTATION(文件)
5.19 FIRE PROTECTION(消防保護)
5.20 ENVIRONMENTAL GUIDELINES(環境方針)
Section 6.0 RECOMMENDATIONS
Section 7.0 - ILLUSTRATIONS
ILLUSTRATION 1 - Mirra Trak System Layout
ATTACHMENT ONE - SURFACE LEAKAGE CURRENT TEST(泄漏測試)
ATTACHMENT TWO - GROUNDING RESISTANCE TEST (接地電阻測試)
ATTACHMENT THREE - VERIFICATION OF EMO(緊急按鈕確認)
ATTACHMENT FOUR - SOUND PRESSURE LEVEL SURVEY(聲壓測試)
ATTACHMENT FIVE - ERGONOMIC CHECKLIST(人體功力檢查表)
ATTACHMENT SIX - MANUAL HANDLING LIFT ANALYSIS(手動操作分析)
ATTACHMENT SEVEN - 揥HAT-IF?” HAZARD ANALYSIS(危險分析)
ATTACHMENT EIGHT - SEMI S10-1296 RISK ASSESSMENT GUIDELINE METHODOLOGY
CONCLUSION


A follow-up safety assessment of the ApplIEd Materials’ Chemical Mechanical Polishing System, Model: Mirra Trak (hereafter referred to as the Mirra Trak), was performed from February 2, 1998 through February 4, 1998. A further re-inspection of the system was performed on June 3, 1998. A preliminary evaluation of the system was also performed on September 25, 1996 through September 26, 1996, and the results of this evaluation were also utilized in this report. Note that this report covers only the concerns raised by integrating tHRee separate systems, the ApplIEd Materials FABS and Mirra CMP, and the OnTrak Synergy Integra, which together form the Mirra Trak system. For further information concerning the individual components, reference the individual SEMI S2-93A reports for these unITs. (GS3 Report No. 970668TF, dated January 30, 1998 for the FABS system; GS3 Report No. 7-0100, dated September 2, 1997 for the Mirra CMP


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世界半導體生產機台安全設計驗收標準英文版(doc 111)簡介結束
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