被焊接的電子和電子彙編的要求(英文)(pdf 38頁)

1 SCOPE
This standard prescribes practices and requirements for the manufacture of soldered electrical and electronic assemblies. Historically,
electronic assembly (soldering) standards contained a more comprehensive tutorial addressing principles and techniques. For a more
complete understanding of this document’s recommendations and requirements, one may use this document in conjunction with IPCHDBK-
001 and IPC-A-610.
When IPC/EIA J-STD-001 is cited or required by contract, the requirements of IPC-A-610 do not apply unless separately or
specifically required. When IPC-A-610 is cited along with IPC/EIA J-STD-001, the order of precedence is to be defined in the
procurement documents.
1.1 Purpose This standard describes materials, methods and acceptance criteria for producing soldered electrical and electronic
assemblies. The intent of this document is to rely on process control methodology to ensure consistent quality levels during the
manufacture of products. It is not the intent of this standard to exclude any procedure for component placement or for applying flux
and solder used to make the electrical connection. The methods used shall (D1 D2 D3) produce completed solder joints conforming to
the acceptability requirements described in this standard.
The requirements for assembly, soldering, soldered connections, cleaning, coating/encapsulation, rework, and verification are defined
in general terms.……
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