晶片的來料檢驗(ppt 23頁)

Chipouts on edge of die shall not penetrate into any active circuit area. Note: Active circuit area is defined as from outside edge of the bond pads inward, except where there is an active line in the design located beyond the outside edge of the bond pads
Cracks shall not be longer than 1.0 mil inside active circuit area that points toward operating metal or functional circuit element.
Cracks that do not point toward operating metal or functional circuit elements shall not exceed 5.0 mils in length. (Silicon & GaAs Die)
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